A series of polyimide(PIs)was prepared by reacting 1,2,4,5-cyclohexane tetracarboxylic dianhydride(CHDA), 3,3’,4,4’-diphenylsulfone tetracarboxylic dianhydride(DSDA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride(BPDA) and bicyclo(2,2,2)oct-7-ene-2,3,5,6-tetracarboxylic dianhydride(BTDA) as the anhydride monomers and 1,3-bis(3-aminophenoxy)benzene(m-BAPB), bis(3-aminophenyl)sulfone(m-APS) and bis[4-(3-aminophenoxy)phenyl]sulfone(m-BAPS) as the amine monomer in N,N-dimethylacetamide(DMAc). Transparent polyimide(PI) films were obtained by solution casting the poly(amic acid)s(PAAs) at various heat treatment temperatures. The thermal properties of the PI films were examined using differential scanning calorimetry(DSC), thermogravimetric analysis(TGA), and thermomechanical analysis(TMA), and their optical transparencies were also investigated using ultraviolet-visible(UV-vis.) spectrophotometry and colorimetry. The yellow index(YI) and coefficient of thermal expansion(CTE) values of all PIs were in the range 2.19 ~ 57.22 and 59 ~ 92 ppm/℃, respectively. The oxygen transmission rate (O2TR) and moisture vapor transmission rate (MVTR) values of the films containing various dianhydride monomers were in the range <0.01~14.93 cc/(m2•day) and 9.71~68.30 g/(m2•day), respectively.